TCZ-1500X High Volume Thin Beam LTPS Processing System

TCZ’s next generation TCZ-1500X system allows manufacturers to scale LTPS (low temperature poly silicon) material production to the larger more efficient G5.5 glass size. Building on the original TCZ-900X thin beam laser crystallization system, TCZ has added many new features to improve glass handling efficiency and reliability including a panel alignment vision system and a new XYZ motion stage.

The TCZ-1500X utilizes Cymer’s latest generation high power XLX 300 light source, whilst optics systems continue to be provided by Carl Zeiss. The TCZ-1500X system has the following features:

• Precision handling of substrates sizes up to 1500 mm x 1300 mm (Generation 5.5)
• Comprehensive system- and module metrology for improved stability and control
• Full 730 mm beam length for scanning substrates in single passes to avoid stitching
• Multi-kHz laser repetition rates facilitating substrate scan speeds of up to 176 cm²/s, compatible with cycle times of 200 seconds or less